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List of AMD processors with 3D graphics

This is a list of microprocessors designed by AMD containing a 3D integrated graphics processing unit (iGPU), including those under the AMD APU (Accelerated Processing Unit) product series.

Features overview

The following table shows features of AMD's processors with 3D graphics, including APUs.

[ VisualEditor ]
Platform High, standard and low power Low and ultra-low power
Codename Server Basic Toronto
Micro Kyoto
Desktop Performance Raphael Phoenix
Mainstream Llano Trinity Richland Kaveri Kaveri Refresh (Godavari) Carrizo Bristol Ridge Raven Ridge Picasso Renoir Cezanne
Entry
Basic Kabini Dalí
Mobile Performance Renoir Cezanne Rembrandt Dragon Range
Mainstream Llano Trinity Richland Kaveri Carrizo Bristol Ridge Raven Ridge Picasso Renoir
Lucienne 		Cezanne
Barceló 		Phoenix
Entry Dalí Mendocino
Basic Desna, Ontario, Zacate Kabini, Temash Beema, Mullins Carrizo-L Stoney Ridge Pollock
Embedded Trinity Bald Eagle Merlin Falcon,
Brown Falcon 		Great Horned Owl Grey Hawk Ontario, Zacate Kabini Steppe Eagle, Crowned Eagle,
LX-Family 		Prairie Falcon Banded Kestrel River Hawk
Released Aug 2011 Oct 2012 Jun 2013 Jan 2014 2015 Jun 2015 Jun 2016 Oct 2017 Jan 2019 Mar 2020 Jan 2021 Jan 2022 Sep 2022 Jan 2023 Jan 2011 May 2013 Apr 2014 May 2015 Feb 2016 Apr 2019 Jul 2020 Jun 2022 Nov 2022
CPU microarchitecture K10 Piledriver Steamroller Excavator "Excavator+"[1] Zen Zen+ Zen 2 Zen 3 Zen 3+ Zen 4 Bobcat Jaguar Puma Puma+[2] "Excavator+" Zen Zen+ "Zen 2+"
ISA x86-64 v1 x86-64 v2 x86-64 v3 x86-64 v4 x86-64 v1 x86-64 v2 x86-64 v3
Socket Desktop Performance — AM5 — —
Mainstream — AM4 — —
Entry FM1 FM2 FM2+ FM2+[a], AM4 AM4 —
Basic — — AM1 — FP5 —
Other FS1 FS1+, FP2 FP3 FP4 FP5 FP6 FP7 FL1 FP7
FP7r2
FP8 		FT1 FT3 FT3b FP4 FP5 FT5 FP5 FT6
PCI Express version 2.0 3.0 4.0 5.0 4.0 2.0 3.0
CXL — —
Fab. (nm) GF 32SHP
(HKMG SOI) 		GF 28SHP
(HKMG bulk) 		GF 14LPP
(FinFET bulk) 		GF 12LP
(FinFET bulk) 		TSMC N7
(FinFET bulk) 		TSMC N6
(FinFET bulk) 		CCD: TSMC N5
(FinFET bulk)
cIOD: TSMC N6
(FinFET bulk) 		TSMC 4nm
(FinFET bulk) 		TSMC N40
(bulk) 		TSMC N28
(HKMG bulk) 		GF 28SHP
(HKMG bulk) 		GF 14LPP
(FinFET bulk) 		GF 12LP
(FinFET bulk) 		TSMC N6
(FinFET bulk)
Die area (mm2) 228 246 245 245 250 210[3] 156 180 210 CCD: (2x) 70
cIOD: 122 		178 75 (+ 28 FCH) 107 ? 125 149 ~100
Min TDP (W) 35 17 12 10 15 65 35 4.5 4 3.95 10 6 12 8
Max APU TDP (W) 100 95 65 45 170 54 18 25 6 54 15
Max stock APU base clock (GHz) 3 3.8 4.1 4.1 3.7 3.8 3.6 3.7 3.8 4.0 3.3 4.7 4.3 1.75 2.2 2 2.2 3.2 2.6 1.2 3.35 2.8
Max APUs per node[b] 1 1
Max core dies per CPU 1 2 1 1
Max CCX per core die 1 2 1 1
Max cores per CCX 4 8 2 4 2 4
Max CPU[c] cores per APU 4 8 16 8 2 4 2 4
Max threads per CPU core 1 2 1 2
Integer pipeline structure 3+3 2+2 4+2 4+2+1 1+3+3+1+2 1+1+1+1 2+2 4+2 4+2+1
i386, i486, i586, CMOV, NOPL, i686, PAE, NX bit, CMPXCHG16B, AMD-V, RVI, ABM, and 64-bit LAHF/SAHF Yes Yes
IOMMU[d] — v2 v1 v2
BMI1, AES-NI, CLMUL, and F16C Yes — Yes
MOVBE — Yes
AVIC, BMI2, RDRAND, and MWAITX/MONITORX — Yes
SME[e], TSME[e], ADX, SHA, RDSEED, SMAP, SMEP, XSAVEC, XSAVES, XRSTORS, CLFLUSHOPT, CLZERO, and PTE Coalescing — Yes — Yes
GMET, WBNOINVD, CLWB, QOS, PQE-BW, RDPID, RDPRU, and MCOMMIT — Yes — Yes
MPK, VAES — Yes —
SGX — —
FPUs per core 1 0.5 1 1 0.5 1
Pipes per FPU 2 2
FPU pipe width 128-bit 256-bit 80-bit 128-bit 256-bit
CPU instruction set SIMD level SSE4a[f] AVX AVX2 AVX-512 SSSE3 AVX AVX2
3DNow! 3DNow!+ — —
PREFETCH/PREFETCHW Yes Yes
GFNI — Yes —
AMX —
FMA4, LWP, TBM, and XOP — Yes — — Yes —
FMA3 Yes Yes
AMD XDNA — Yes —
L1 data cache per core (KiB) 64 16 32 32
L1 data cache associativity (ways) 2 4 8 8
L1 instruction caches per core 1 0.5 1 1 0.5 1
Max APU total L1 instruction cache (KiB) 256 128 192 256 512 256 64 128 96 128
L1 instruction cache associativity (ways) 2 3 4 8 2 3 4 8
L2 caches per core 1 0.5 1 1 0.5 1
Max APU total L2 cache (MiB) 4 2 4 16 1 2 1 2
L2 cache associativity (ways) 16 8 16 8
Max on-die L3 cache per CCX (MiB) — 4 16 32 — 4
Max 3D V-Cache per CCD (MiB) — 64 — —
Max total in-CCD L3 cache per APU (MiB) 4 8 16 64 4
Max. total 3D V-Cache per APU (MiB) — 64 — —
Max. board L3 cache per APU (MiB) — —
Max total L3 cache per APU (MiB) 4 8 16 128 4
APU L3 cache associativity (ways) 16 16
L3 cache scheme Victim Victim
Max. L4 cache — —
Max stock DRAM support DDR3-1866 DDR3-2133 DDR3-2133, DDR4-2400 DDR4-2400 DDR4-2933 DDR4-3200, LPDDR4-4266 DDR5-4800, LPDDR5-6400 DDR5-5200 DDR5-5600, LPDDR5x-7500 DDR3L-1333 DDR3L-1600 DDR3L-1866 DDR3-1866, DDR4-2400 DDR4-2400 DDR4-1600 DDR4-3200 LPDDR5-5500
Max DRAM channels per APU 2 1 2 1 2
Max stock DRAM bandwidth (GB/s) per APU 29.866 34.132 38.400 46.932 68.256 102.400 83.200 120.000 10.666 12.800 14.933 19.200 38.400 12.800 51.200 88.000
GPU microarchitecture TeraScale 2 (VLIW5) TeraScale 3 (VLIW4) GCN 2nd gen GCN 3rd gen GCN 5th gen[4] RDNA 2 RDNA 3 TeraScale 2 (VLIW5) GCN 2nd gen GCN 3rd gen[4] GCN 5th gen RDNA 2
GPU instruction set TeraScale instruction set GCN instruction set RDNA instruction set TeraScale instruction set GCN instruction set RDNA instruction set
Max stock GPU base clock (MHz) 600 800 844 866 1108 1250 1400 2100 2400 400 538 600 ? 847 900 1200 600 1300 1900
Max stock GPU base GFLOPS[g] 480 614.4 648.1 886.7 1134.5 1760 1971.2 2150.4 3686.4 102.4 86 ? ? ? 345.6 460.8 230.4 1331.2 486.4
3D engine[h] Up to 400:20:8 Up to 384:24:6 Up to 512:32:8 Up to 704:44:16[5] Up to 512:32:8 768:48:8 128:8:4 80:8:4 128:8:4 Up to 192:12:8 Up to 192:12:4 192:12:4 Up to 512:?:? 128:?:?
IOMMUv1 IOMMUv2 IOMMUv1 ? IOMMUv2
Video decoder UVD 3.0 UVD 4.2 UVD 6.0 VCN 1.0[6] VCN 2.1[7] VCN 2.2[7] VCN 3.1 ? UVD 3.0 UVD 4.0 UVD 4.2 UVD 6.2 VCN 1.0 VCN 3.1
Video encoder — VCE 1.0 VCE 2.0 VCE 3.1 — VCE 2.0 VCE 3.4
AMD Fluid Motion No Yes No No Yes No
GPU power saving PowerPlay PowerTune PowerPlay PowerTune[8]
TrueAudio — Yes[9] ? — Yes
FreeSync 1
2 		1
2
HDCP[i] ? 1.4 2.2 2.3 ? 1.4 2.2 2.3
PlayReady[i] — 3.0 not yet — 3.0 not yet
Supported displays[j] 2–3 2–4 3 3 (desktop)
4 (mobile, embedded)		 4 2 3 4 4
/drm/radeon[k][11][12] Yes — Yes —
/drm/amdgpu[k][13] — Yes[14] — Yes[14]
  1. ^ For FM2+ Excavator models: A8-7680, A6-7480 & Athlon X4 845.
  2. ^ A PC would be one node.
  3. ^ An APU combines a CPU and a GPU. Both have cores.
  4. ^ Requires firmware support.
  5. ^ a b Requires firmware support.
  6. ^ No SSE4. No SSSE3.
  7. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  8. ^ Unified shaders : texture mapping units : render output units
  9. ^ a b To play protected video content, it also requires card, operating system, driver, and application support. A compatible HDCP display is also needed for this. HDCP is mandatory for the output of certain audio formats, placing additional constraints on the multimedia setup.
  10. ^ To feed more than two displays, the additional panels must have native DisplayPort support.[10] Alternatively active DisplayPort-to-DVI/HDMI/VGA adapters can be employed.
  11. ^ a b DRM (Direct Rendering Manager) is a component of the Linux kernel. Support in this table refers to the most current version.

Graphics API overview

The following table shows the graphics and compute APIs support across ATI/AMD GPU microarchitectures. Note that a branding series might include older generation chips.

[ VisualEditor ]
Chip series Micro­architecture Fab Supported APIs AMD support Year introduced Introduced with
Rendering Computing / ROCm
Vulkan[15] OpenGL[16] Direct3D HSA OpenCL
Wonder Fixed-pipeline[a] 1000 nm
800 nm 		— — — — — Ended 1986 Graphics Solutions
Mach 800 nm
600 nm 		1991 Mach8
3D Rage 500 nm 5.0 1996 3D Rage
Rage Pro 350 nm 1.1 6.0 1997 Rage Pro
Rage 128 250 nm 1.2 1998 Rage 128 GL/VR
R100 180 nm
150 nm 		1.3 7.0 2000 Radeon
R200 Programmable
pixel & vertex
pipelines 		150 nm 8.1 2001 Radeon 8500
R300 150 nm
130 nm
110 nm 		2.0[b] 9.0
11 (FL 9_2) 		2002 Radeon 9700
R420 130 nm
110 nm 		9.0b
11 (FL 9_2) 		2004 Radeon X800
R520 90 nm
80 nm 		9.0c
11 (FL 9_3) 		2005 Radeon X1800
R600 TeraScale 1 80 nm
65 nm 		3.3 10.0
11 (FL 10_0) 		ATI Stream 2007 Radeon HD 2900 XT
RV670 55 nm 10.1
11 (FL 10_1) 		ATI Stream APP[17] Radeon HD 3850/3870
RV770 55 nm
40 nm 		1.0 2008 Radeon HD 4850/4870
Evergreen TeraScale 2 40 nm 4.5
(Linux 4.2)
[18][19][20][c] 		11 (FL 11_0) 1.2 2009 Radeon HD 5850/5870
Northern Islands TeraScale 2
TeraScale 3 		2010 Radeon HD 6850/6870
Radeon HD 6950/6970
Southern Islands GCN 1st gen 28 nm 1.0 4.6 11 (FL 11_1)
12 (FL11_1) 		Yes 1.2
2.0 possible 		2012 Radeon HD 7950/7970
Sea Islands GCN 2nd gen 1.2 11 (FL 12_0)
12 (FL 12_0) 		2.0
(1.2 in MacOS, Linux)
2.1 Beta in Linux ROCm
2.2 possible 		2013 Radeon HD 7790
Volcanic Islands GCN 3rd gen 2014 Radeon R9 285
Arctic Islands GCN 4th gen 28 nm
14 nm 		1.2

1.4 (GCN 4)

Supported 2016 Radeon RX 480
Polaris 2017 Radeon 520/530
Radeon RX 530/550/570/580
Vega GCN 5th gen 14 nm
7 nm 		1.4 11 (FL 12_1)
12 (FL 12_1) 		2017 Radeon Vega Frontier Edition
Navi RDNA 7 nm 2019 Radeon RX 5700 (XT)
Navi 2x RDNA 2 7 nm
6 nm 		11 (FL 12_1)
12 (FL 12_2) 		2020 Radeon RX 6800 (XT)
Navi 3x RDNA 3 6 nm
5 nm 		2022 Radeon RX 7900 XT(X)
Navi 4x RDNA 4 4 nm 2025 Radeon RX 9070 (XT)
  1. ^ Radeon 7000 Series has programmable pixel shaders, but do not fully comply with DirectX 8 or Pixel Shader 1.0. See article on R100's pixel shaders.
  2. ^ These series do not fully comply with OpenGL 2+ as the hardware does not support all types of non-power-of-two (NPOT) textures.
  3. ^ OpenGL 4+ compliance requires supporting FP64 shaders and these are emulated on some TeraScale chips using 32-bit hardware.

[21][22][23]

Desktop processors with 3D graphics

APU or Radeon Graphics branded

Lynx: "Llano" (2011)

  • Socket FM1
  • CPU: K10 (also Husky or K10.5) cores with an upgraded Stars architecture, no L3 cache
  • GPU: TeraScale 2 (Evergreen); all A and E series models feature Redwood-class integrated graphics on die (BeaverCreek for the dual-core variants and WinterPark for the quad-core variants). Sempron and Athlon models exclude integrated graphics.[24]
  • List of embedded GPU's
  • Support for up to four DIMMs of up to DDR3-1866 memory
  • Fabrication 32 nm on GlobalFoundries SOI process; Die size: 228 mm2, with 1.178 billion transistors[25][26]
  • 5 GT/s UMI
  • Integrated PCIe 2.0 controller
  • Select models support Turbo Core technology for faster CPU operation when the thermal specification permits
  • Select models support Hybrid Graphics technology to assist a discrete Radeon HD 6450, 6570, or 6670 discrete graphics card. This is similar to the Hybrid CrossFireX technology available in the AMD 700 and 800 chipset series
Model[note 1] Released Fab Step. CPU GPU DDR3
memory
support 		TDP
(W) 		Box number Part number
Cores
(threads) 		Clock rate (GHz) Cache[a] Model Config Clock
(MHz) 		Processing
power
(GFLOPS)[b]
Base Boost L1 L2
Sempron X2 198 2012 32 nm SOI LN-B0 2 (2) 2.5 — 64 KB inst.
64 KB data

per core 		2×512 KB — 1600 65 SD198XOJGXBOX SD198XOJZ22GX
Athlon II X2 221 2012 2.8 AD221XOJGXBOX AD221XOJZ22GX
Athlon II X4 631 2012 4 (4) 2.6 4×1 MB 1866 AD631XOJGXBOX AD631XOJZ43GX
Aug 15, 2011 100 AD631XOJGXBOX AD631XWNZ43GX
Athlon II X4 638 Feb 8, 2012 2.7 65 AD638XOJGXBOX AD638XOJZ43GX
Athlon II X4 641 Feb 8, 2012 2.8 100 AD641XWNGXBOX AD641XWNZ43GX
Athlon II X4 651 Nov 14, 2011 3.0 AD651XWNGXBOX AD651XWNZ43GX
Athlon II X4 651K 2012 AD651KWNGXBOX AD651KWNZ43GX
E2-3200 2011 2 (2) 2.4 2×512 KB HD 6370D 160:8:4 443 141.7 1600 65 ED3200OJGXBOX ED3200OJZ22GX
ED3200OJZ22HX
A4-3300 Sep 7, 2011 2.5 HD 6410D AD3300OJGXBOX
AD3300OJHXBOX 		AD3300OJZ22GX
AD3300OJZ22HX
A4-3400 Sep 7, 2011 2.7 600 192 AD3400OJGXBOX
AD3400OJHXBOX 		AD3400OJZ22GX
AD3400OJZ22HX
A4-3420 Dec 20, 2011 2.8 — AD3420OJZ22HX
A6-3500 Aug 17, 2011 3 (3) 2.1 2.4 3×1 MB HD 6530D 320:16:8 443 283.5 1866 AD3500OJGXBOX AD3500OJZ33GX
A6-3600 Aug 17, 2011 4 (4) 4×1 MB AD3600OJGXBOX AD3600OJZ43GX
A6-3620 Dec 20, 2011 2.2 2.5 AD3620OJGXBOX AD3620OJZ43GX
A6-3650 Jun 30, 2011 2.6 — 100 AD3650WNGXBOX AD3650WNZ43GX
A6-3670K Dec 20, 2011 2.7 AD3670WNGXBOX AD3670WNZ43GX
A8-3800 Aug 17, 2011 2.4 2.7 HD 6550D 400:20:8 600 480 65 AD3800OJGXBOX AD3800OJZ43GX
A8-3820 Dec 20, 2011 2.5 2.8 AD3820OJGXBOX AD3820OJZ43GX
A8-3850 Jun 30, 2011 2.9 — 100 AD3850WNGXBOX AD3850WNZ43GX
A8-3870K Dec 20, 2011 3.0 AD3870WNGXBOX AD3870WNZ43GX
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ Models with "K" suffixes feature an unlocked multiplier and overclockable GPU.

Virgo: "Trinity" (2012)

Model Released Fab Step. CPU GPU DDR3
memory
support 		TDP
(W) 		Box number Part number[34]
[Modules/FPUs]
Cores/threads 		Clock rate (GHz) Cache[a] Model Config Clock
(MHz) 		Processing
power
(GFLOPS)[b]
Base Boost L1 L2
Sempron X2 240[35] 32 nm TN-A1 [1]2 2.9 3.3 64 KB inst.
per module

16 KB data
per core 		1 MB — 1600 65 SD240XOKA23HJ
Athlon X2 340[36] Oct 2012 3.2 3.6 AD340XOKA23HJ
Athlon X4 730 Oct 1, 2012 [2]4 2.8 3.2 2×2 MB 1866 AD730XOKA44HJ
Athlon X4 740 Oct 2012 3.2 3.7 AD740XOKHJBOX AD740XOKA44HJ
Athlon X4 750K 3.4 4.0 100 AD750KWOHJBOX AD750KWOA44HJ
FirePro A300 Aug 7, 2012 3.4 4.0 FirePro 384:24:8
6 CU 		760 583.6 65 AWA300OKA44HJ
FirePro A320 3.8 4.2 800 614.4 100 AWA320WOA44HJ
A4-5300 Oct 1, 2012 [1]2 3.4 3.6 1 MB HD 7480D 128:8:4
2 CU 		723 185 1600 65 AD5300OKHJBOX AD5300OKA23HJ
A4-5300B Oct 2012 AD530BOKA23HJ
A6-5400K Oct 1, 2012 3.6 3.8 HD 7540D 192:12:4
3 CU 		760 291.8 1866 AD540KOKHJBOX AD540KOKA23HJ
A6-5400B Oct 2012 AD540BOKA23HJ
A8-5500 Oct 1, 2012 [2]4 3.2 3.7 2×2 MB HD 7560D 256:16:8
4 CU 		760 389.1 AD5500OKHJBOX AD5500OKA44HJ
A8-5500B Oct 2012 AD550BOKA44HJ
A8-5600K Oct 1, 2012 3.6 3.9 100 AD560KWOHJBOX AD560KWOA44HJ
A10-5700 3.4 4.0 HD 7660D 384:24:8
6 CU 		760 583.6 65 AD5700OKHJBOX AD5700OKA44HJ
A10-5800K 3.8 4.2 800 614.4 100 AD580KWOHJBOX AD580KWOA44HJ
A10-5800B Oct 2012 AD580BWOA44HJ
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Richland" (2013)

Model Released Fab Step. CPU GPU DDR3
memory
support 		TDP
(W) 		Box number Part number
[Modules/FPUs]
Cores/threads 		Clock rate (GHz) Cache[a] Model Config Clock
(MHz) 		Processing
power
(GFLOPS)[b]
Base Boost L1 L2
Sempron X2 250[35] 32 nm RL-A1 [1]2 3.2 3.6 64 KB inst.
per module

16 KB data
per core 		1 MB — 65 SD250XOKA23HL
Athlon X2 350[38]